What is a solder land?

Solder Mask Defined (SMD) Solder Lands The solder land size is defined by the solder mask opening. Considering the offset tolerances for the solder masking process, the copper must be larger than the actual solder land by at least 75 μm on each side. This value may vary depending on the class of PCB used.

What is PCB Land Pattern?

A footprint or land pattern is the arrangement of pads (in surface-mount technology) or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board. The land pattern on a circuit board matches the arrangement of leads on a component.

What is the difference between QFN and QFP?

The pins on a QFP IC are usually spaced by anywhere from 0.4mm to 1mm. The connections on QFN packages are tiny, exposed pads on the bottom corner edges of the IC. Sometimes they wrap around, and are exposed on both the side and bottom, other packages only expose the pad on the bottom of the chip.

How tall is a qfp64 Quad Flat Package?

 Package summary Parameter Min Nom Max Unit package length 13.9 14 14.1 mm package width 13.9 14 14.1 mm package height 2 2.2 2.4 mm nominal pitch – 0.8 – mm actual quantity of termination – 64 – NXP SemiconductorsSOT1697-1 QFP64, plastic, quad flat package; 64 terminals; 0.8 mm pitch; 14 mm x 14 mm x 2.2 mm body

Where can I find the qfp64 datasheet?

Yamaichi Electronics Co… Series Overview QFP (Quad Flat Packages, Gullwing Leads) List of Unclassifed Man… Buzzer output, remote control carrier signal output, high-current drive port List of Unclassifed Man…

What is the standard form of a QFP?

The standard form is a leaded plastic package with a flat rectangular body, usually square. Leads extend from all four sides of the body. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. Standard Pb-free lead finish is matte tin. Thermally enhanced QFPs may be offered with an Exposed Pad (EP).

How big is the terminal pitch of a QFP?

QFP main features are: • Package size: 5 x 5 mm2to 32 x 32 mm2 • Terminal Counts: 32 to 240 • Terminal pitch: 0.4 mm to 0.8 mm • Terminal plating: Sn, Ni-Pd-Au • Package thickness: –H/LQFP: 1.4 mm –H/TQFP: 1.0 mm –QFP: > 1.6 mm • Meets RoHS, ELV and REACH • Halogen-free and lead-free compliant Figure 1 shows examples of some standard QFP packages.