What is a WLCSP package?

Freescale Semiconductor, Inc. 3 Wafer Level Chip Scale Package (WLCSP) 3.1. Package Description. Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from a wafer.

What is WLP in Semiconductor?

Wafer-level packaging (WLP) is the technology of packaging the die while it is still on the wafer—protective layers and electrical connections are added to the substrate before dicing. Originally, wafers were diced into individual chips, then packaged.

Why do wafers bump?

Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device.

Which is the best package for a WLCSP?

The beauty in WLCSP package is the connectivity. The connectivity between the silicon die is merely bumps which offer low resistance, and low inductance. WLCSP is not cheap for low-mid volume production, but for many market segments and applications, WLCSP is the best choice in terms of price and performance.

What is a wafer level chip scale package ( WLCSP )?

In the final form, the device is a die with an array pattern of bumps or solder balls attached at an I/O pitch that is compatible with traditional circuit board assembly processes. WLCSP is a true chip-scale packaging (CSP) technology, since the resulting package is of th e same size of the die (Figure 1).

What are the dimensions of a WLCSP ball?

Figure 1. WLCSP Packages Available from Freescale. 3.2 Typical WLCSP Configurations and Dimensions. Available WLCSP packages from Freescale range from 2.0 x 2.0 mm to 5.29 x 5.28 mm in size, with a. standard pitch of 0.40mm and a standard solder ball diameter of 0.250mm.

What’s the difference between fan in and Fan Out WLCSP?

For semiconductor professional Fan-In WLCSP is a true wafer level packaging, because the pads (or bumps) are all within (under) the die footprint. While Fan-out WLCSP offers a package size beyond the size of silicon dies to allow higher bump pitch.