What is thermal interface material made of?

Mostly made of silicone or silicone-like material, it has the advantage to be easy to apply. It provides thicker bond lines, but will usually need higher force to press the heat sink on the heat source so that the thermal pad conforms to the bonded surfaces.

What is Thermal Interface Material Paste?

Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat …

Is thermal interface material necessary?

Thermal paste, or some oily thermal interface material, is necessary because it fills in the microscopic imperfections that otherwise trap air particles between the CPU and the heatsink, preventing the CPU from properly cooling.

What is thermal management materials?

Temprion® Thermal Management Materials Temprion® electrically insulating films and adhesive thermal tapes offer excellent thermal conductivity, lower thermal resistance, higher heat dissipation and improved thermal stability during continuous operation.

How many patents does Ravi Prasher have in his name?

Ravi has published more 90 archival journal papers in top science and engineering journals such as Nature Nanotechnology, Physical Review Letters and Journal of Heat Transfer. He holds more than 35 patents in the area of thermoelectrics, microchannels, heat pipes, thermal interface materials, nanostructured materials and devices.

Who is Ravi Prasher and what does he do?

He is also an adjunct professor in the Department of Mechanical Engineering at the University of California, Berkeley. Ravi joined Berkeley Lab in June, 2015. Previously, he was vice president of product development of Sheetak Inc., a startup developing solid state thermoelectric energy converters.

Which is the best model for thermal interface materials?

Prasher et al. [6] have developed an empirical model for the BLT of particle laden polymeric thermal interface materials. They conducted a study on eight different formulations of particle laden polymeric TIMs, which included thermal greases and phase change materials and proposed the following correlation for BLT:

What did Ravi Prasher do before ARPA-E?

Prior to joining ARPA-E, Ravi was the technology development manager of the thermal management group at Intel. He was also an adjunct professor in the school of engineering at Arizona State University (ASU) from 2005-2013, where his research was funded by the National Science Foundation and the Office of Naval Research.